High Strength Epoxy Potting Adhesive for Electronics
The ZDS-168AB-D is a high-performance, two-component epoxy adhesive designed specifically for electronic applications requiring outstanding insulation, waterproofing, and moderate thermal conductivity. This epoxy features a black/grey appearance and a viscosity range of 6000-8000 cps, making it suitable for complex potting, encapsulation, and bonding needs. Offering a practical working time of 30-60 minutes at room temperature, ZDS-168AB-D cures to a robust 80 Shore D hardness, ensuring both strong mechanical properties and reliable electrical insulation. With a mixing ratio of 8:1 and a pot life ranging from 4 to 16 hours dependent on temperature and application size, this epoxy provides flexibility for industrial-scale electronics assembly. Its dependable performance extends to applications involving electric motors, LED units, PCBs, sensors, and various electronic components that demand excellent adhesion, moisture resistance, and electrical insulation.
- Provides excellent electrical insulation and moderate thermal conductivity (0.8 W/mยทK)
- Black or grey finish for aesthetic and identification requirements
- Efficient processing time, with 30-60 minute working life allowing for precise application
- Outperforms in harsh environments, protecting against water, dust, and mechanical stress
- Ideal for potting, encapsulating, sealing, and bonding electronic and electrical components
Key Benefits of ZDS-168AB-D
- High chemical and humidity resistance
- Maintains performance across a wide temperature range
- Low shrinkage during curing
- Enhanced dielectric properties for sensitive electronics
