ZDS-CC2008191B UV Peelable Solder Joint Adhesive

Home » Adhesive Type » ZDS-CC2008191B

Get Best Solution

PropertyValue
BrandZDS
ModelZDS-CC2008191B
AppearanceColorless paste
Viscosity8000-30000 cps
Hardness70-75A
Cure Time800-1500 mJ (50W LED light)
Elongation at Break>250%
AdhesionGlass, General Plastics

High Flexibility UV Peelable Solder Joint Adhesive for Electronics and Plastics

The ZDS-CC2008191B is a highly specialized UV-curable adhesive engineered for peelable solder joint protection and sealing. Developed to satisfy demanding electronics and industrial applications, this transparent colorless paste sets a new benchmark in flexibility and thixotropic performance. Its elongation at break exceeding 250% ensures reliability in flexible assembly lines and applications subject to movement or vibration, like electronics manufacturing or PCB assembly.

  • Peelable Solder Mask: Designed to provide an effective, peelable barrier over solder joints, facilitating post-soldering cleaning or testing while maintaining excellent adherence during process steps.
  • Superior Flexibility: The formula maintains high elongation and recovery properties, reducing chip cracking, delamination, and mechanical stress after curing.
  • Outstanding Thixotropy: The paste features controlled thixotropy, minimizing sag and enabling precise dispensing on vertical or complex surfaces without excessive slumping or migration.
  • Excellent Adhesion: Bonds reliably to glass and general plastics commonly used in electronic devices, sensors, optical assemblies, and more.
  • Rapid UV Cure: Cures efficiently within 800-1500 mJ of UV energy from a 50W LED source, allowing high-volume, fast-paced inline manufacturing with minimal thermal input.
  • Safe for Sensitive Components: Its colorless, low-extractable formulation is designed with minimal contaminants, making it compatible for use with sensitive materials and microelectronics.

Typical Applications

  • PCB peelable solder joints during wave soldering;
  • Temporary sealing and masking on plastic and glass substrates;
  • Electronics and FDC (Flexible Display Circuit) assembly;
  • General plastics or glass component bonding/sealing where post-process removal is required.

Key Benefits

  • Non-corrosive; minimal residue after removal;
  • Enables inspection and rework;
  • Stable in storage and use;
  • Environmentally friendly – low odor and low VOC.

ZDS LTD ยท Adhesive Manufacturer

Get the Right Adhesive Recommendation

Not sure which adhesive fits your material, process, or performance needs?
Share a few project details, and our team will suggest a suitable ZDS product or custom formulation.