High-Performance UV Adhesive for Solder Joint Protection and ABS Bonding
The ZDS-CC200612 UV-sensitive adhesive paste is specially designed for industries seeking top performance in low-temperature resistant solder joint protection as well as reliable bonding to ABS material components. This innovative formula comes in a paste appearance, offering superior handling and precise application, especially ideal for electronics manufacturing and assembly lines. The UV-curing mechanism ensures a rapid and robust solidification, providing efficiency and durability in demanding working environments.
- UV-curable formula for rapid processing and high throughput
- Wide viscosity range (10000–55000cps) for excellent versatility
- Shore A hardness of 75–85A for optimal flexibility and durability
- Strong adhesion and long-term resistance to low temperatures
- Specialized for solder joint protections and ABS structural bonding
- Curing achieved under 500mj energy with 50W LED (395/365nm)
- Suitable for intricate electronics, PCBs, and plastic assembly
- Minimizes thermal stress, ensuring joint safety and longevity
This UV adhesive is engineered for industries that require fine, effective protection of solder joints and secure ABS material bonding without compromising processing speed. Whether in automotive electronics, consumer electronics, or complex appliance assembly, ZDS-CC200612 offers an advanced solution to your connection and encapsulation needs.
