High Performance Epoxy Potting Adhesive for Demanding Electronics
The ZDS-369AB epoxy potting adhesive is engineered for high temperature and high pressure sealing applications where durability and stability are paramount. Featuring a robust viscosity range of 5000-6000cps, it provides reliable encapsulation and excellent mechanical protection for sensitive electronic components. With an impressive hardness of 90 Shore D, this two-component epoxy ensures secure and lasting performance under demanding conditions.
- Color and Appearance: The product presents a black or light yellow finish, suitable for both aesthetic and functional needs, offering visible coverage and uniform application.
- Strong Thermal Resistance: With staged cure cycles at 85°C/2H, 100°C/2H, and 150°C/2H, ZDS-369AB withstands sustained exposure to elevated temperatures, making it ideal for electronics operating in harsh environments.
- Potting and Sealing: Specifically formulated for potting, sealing, and protecting printed circuit boards, sensors, and other intricate components requiring insulation and protection.
- Mix Ratio: The recommended mix ratio of 100:120 (2:1) ensures optimal curing and strong adhesive performance.
- High Pressure Endurance: Designed to endure pressures up to 250 units, making it suitable for automotive and industrial electronics that require both mechanical and environmental stability.
This epoxy’s extended working life (8 hours at ambient temperature) allows for flexible application processes, while the staged thermal cure sequence delivers enhanced chemical resistance and long-term reliability. Applications include automotive ECU modules, industrial control units, sensors, PCB potting, and battery pack encapsulation.
