High Temperature Resistant, High Thermal Conductivity Epoxy Adhesive
ZDS-369AB-HD is a professional-grade epoxy adhesive engineered for applications requiring superior thermal resistance and high thermal conductivity. Featuring a robust viscosity range of 6000-8000 cps, this product cures to a hardness of 92 and withstands operating temperatures up to 150°C. With its distinctive black/grey appearance, ZDS-369AB-HD delivers excellent bonding strength, making it ideal for demanding electronic, automotive, and industrial uses. The adhesive can be cured either at room temperature over 8 hours or through staged heating (90°C/2H, 120°C/2H, 150°C/2H), offering flexibility for various manufacturing processes.
- Outstanding high temperature resilience ensures long-term bond integrity.
- Highly efficient thermal conductivity rating of 2.5 W/m·K maximizes component cooling and protection.
- 4:1 two-component mix for precise application and optimal performance.
- Excellent electrical insulation properties help protect sensitive circuits and components.
- Resistant to environmental stress and aging for durable, long-lasting adhesion.
- Versatile compatibility with metals, plastics, ceramics, and electronic substrates.
Whether used for sealing, potting, or bonding in electronic housings, automotive batteries, or high-power devices, ZDS-369AB-HD offers a reliable adhesive solution that enhances component safety and operational longevity. Its advanced formula supports demanding environments such as automotive electronics, power modules, and industrial assemblies in need of elevated protection and heat dissipation.
