High Temperature Resistant Epoxy Potting Compound ZDS-368AB
ZDS-368AB epoxy adhesive is a specially formulated high temperature potting compound designed for superior thermal resistance and reliable insulation. With a viscosity range of 5000-8000 cps, it is easily applied and ensures thorough encapsulation of sensitive electronic components. The product cures to a tough, black appearance with outstanding hardness ratings after full cure.
- Versatile Temperature Cure Profiles: Can be cured at 60°C for 2 hours plus 115°C for another 2 hours, or at room temperature for 24 hours followed by 80°C for 2-4 hours, offering flexibility for different production schedules.
- Outstanding Thermal and Electrical Performance: Withstand temperatures up to 88°C with excellent dielectric properties, making it ideal for use in automotive, electronics, and power systems.
- Optimized for Potting and Sealing: Formulation facilitates superior protection of circuit boards, transformers, and other assemblies requiring environmental resistance.
The ZDS-368AB potting compound provides robust adhesion, high mechanical strength, and resistance to chemicals, moisture, and thermal cycling—essential attributes for demanding industrial applications. It is compatible with various substrate materials including plastics, metals, ceramics, and PCBs. Its reliable insulation properties help enhance stability and longevity in electronic devices. Easy mixing ratio of 5:1 or 8:1 enables simplified processing, and the cured compound delivers a solid, protective barrier for sensitive electronics. Widely recommended for electronics, automotive, and renewable energy sectors, ZDS-368AB is your ideal solution for high temperature potting requirements.
