High Temperature Resistant Thermal Conductive Potting Compound
The ZDS-368AB-HD is a specially formulated epoxy potting compound, designed for applications requiring superior thermal conductivity and outstanding high temperature resistance. Available in black or grey, this product boasts a viscosity range of 8000-10000 cps, making it suitable for easy pouring and self-leveling during encapsulation processes. Once cured, it reaches a hardness of 85 Shore D, ensuring robust mechanical protection and durability.
Curing options are flexible, including fast or ambient temperature settings, or controlled elevated temperatures up to 115°C. Its thermal endurance allows reliability at operating temperatures up to 250°C, making it an ideal choice for electronics, automotive, and other industrial fields requiring extreme temperature stability.
- Exceptional thermal conductivity, efficiently dissipating heat in electronic circuits.
- Excellent insulation properties provide enhanced electrical protection.
- Compatible with a variety of ratios: 6:1, 8:1, 10:1 for versatile application needs.
- Provides waterproof encapsulation, safeguarding sensitive components from moisture and environmental effects.
- Smooth appearance and straightforward mixing ratio for convenient use in line production.
This product is engineered for potting and encapsulating high-temperature electronic boards, sensors, battery packs, and modules in environments where heat dissipation and long-term reliability are critical.
