ZDS-368AB-D High Temperature Conductive Potting Silicone
The ZDS-368AB-D is a high-performance, silicone-based potting compound engineered for electronics and other industrial applications demanding excellent thermal conductivity and high-temperature resistance. Offered in a striking black or grey appearance, this silicone system features a medium-to-high viscosity of 8000-10000cps, making it ideal for precise applications. With a fast room temperature cure time of 60 minutes and the option for accelerated curing at elevated temperatures (80ยฐC for 2 hours, 115ยฐC for 2 hours, or 90ยฐC for 2-4 hours following 24 hours at room temperature), ZDS-368AB-D ensures rapid throughput in production environments.
- Outstanding thermal conductivity for sensitive components
- High hardness of 85 Shore A for excellent mechanical protection
- Excellent temperature resistance with operating stability up to 250ยฐC
- Available mix ratios of 6:1, 8:1, or 10:1 for flexible processing
- Optimal for thermal management and electrical insulation in a range of electronics and automotive assemblies
- Pot life tailored for encapsulation and sealing tasks
- High reliability in harsh industrial environments
This silicone potting adhesive is particularly effective at heat dissipation in power components, protection of printed circuit boards (PCBs), encapsulation of sensitive modules, and applications requiring long-term thermal cycling stability. The combination of robust hardness, rapid curing, and high-performance insulation makes it a trusted choice for critical manufacturing lines where reliability and durability are non-negotiable.
