ZDS-169ab High TG Transparent Epoxy Potting Adhesive
ZDS-169ab is a high-performance, transparent epoxy adhesive designed for demanding electronic encapsulation and bonding applications. Featuring a high glass transition temperature (TG) and excellent color stability, this adhesive maintains superb clarity—remaining non-yellowing for up to 26 days under ambient conditions. Its moderate viscosity of 2000-5000cps makes it easy to handle for potting and bonding both small and large components, while its robust hardness of 90-92 Shore D ensures a rigid and durable finish after curing.
- Superior Transparency: The cured adhesive remains crystal-clear, making it ideal for applications where aesthetics are important.
- High TG for Enhanced Thermal Resistance: With operational integrity at temperatures up to 180°C, it is an excellent choice for electronics exposed to elevated heat.
- Versatile Curing Profile: Multiple curing schedules provide flexibility for processing, including room temperature and elevated temperature options.
- Outstanding Yellowing Resistance: Specially engineered to resist yellowing, ensuring assemblies remain visually appealing even after extended use.
- Reliable Potting & Bonding: The two-component system (mix ratio 100:100 by weight) offers consistent, void-free encapsulation and strong adhesion across a range of substrates.
This makes ZDS-169ab an ideal solution for electronics, automotive parts, LED modules, PCB potting, and other critical electronic assemblies where reliability, transparency, and thermal stability are essential.
