Advanced Epoxy Potting Adhesive for Electronics & More
ZDS-168AB-T is a two-component epoxy adhesive engineered for demanding applications requiring insulation, waterproof sealing, and resilient reliability. Its stable viscosity and strong mechanical properties make it ideal for electronic and electrical assemblies, smart devices, and new energy component encapsulation. This product delivers excellent adhesion and fill to various substrates, efficiently replacing traditional sealing and potting solutions. The cured epoxy offers outstanding resistance to moisture, chemicals, and environmental stress, contributing to the long-term durability of your projects.
- Highly resistant to environmental stress and temperature fluctuations
- Reliable insulation, making it perfect for sensitive electronic components
- Designed for efficient waterproofing with excellent elasticity after curing
- Multiple mix ratios (2:1/3:1) for flexible application requirements
- Suitable for black, white, or transparent finishes
- Moderate viscosity for easy flow and complete encapsulation
- Extended pot life of 60-80 minutes allows for precise adjustment and application
- Cures at room temperature within 6-10 hours for improved process efficiency
- Widely applied in electronic, electrical, and new energy industries
Key Features
- Excellent Waterproof & Insulation Effect
- Outstanding Elasticity and Repairability
- Versatile Use for Multiple Applications
- Simple Mixing Ratios and Easy Application
- Extended Working Time Suitable for Large-Scale Potting
