Exceptional Potting and Insulation Epoxy for Electronics
ZDS-168AB is a two-component epoxy adhesive designed specifically for advanced electronic potting, insulation, and waterproofing. Its superior performance makes it a preferred choice for professionals in the electronics manufacturing industry. The product cures to a hard, robust finish, ensuring optimal protection for sensitive electronic components against moisture, dust, and environmental stress while maintaining excellent electrical insulation properties.
- Color versatility: Available in black, white, and red for aesthetic integration and easy identification in complex assemblies.
- Ideal viscosity: With a viscosity range of 4000-6000 cps, ZDS-168AB provides optimal flow and coverage for even the most intricate electronic parts without sagging.
- High hardness: After curing, it achieves up to 85 Shore D, making it durable against physical impact and chemical exposure.
- Efficient application: The workable time of 30-60 minutes at room temperature (25°C) allows for precise placement and adjustment during potting operations.
- Extended protection: Designed to last 6-8 hours in active conditions post-application, ensuring long-term reliability.
- Mix ratio simplicity: 5:1 mixing allows consistent results and straightforward processing for mass production or prototyping.
This adhesive is engineered to support various materials, including plastic, metal, PCB, and composite substrates. Its outstanding resistance to temperature fluctuations and moisture ingress makes ZDS-168AB highly effective for electronic encapsulation, electrical insulation, and waterproof sealing tasks—protecting your valuable devices and boosting operational excellence.
