High-Performance Transparent Epoxy Potting Adhesive
The ZDS-168-3ab is a premium transparent epoxy adhesive formulated to deliver excellent potting and bonding performance in industrial and electronic applications. With a viscosity of 2000-3000cps, this adhesive is tailored for precise and efficient encapsulation. Its cured hardness of 90-92 ensures robust mechanical protection and structural integrity, making it suitable for high-demand environments.
- Outstanding Transparency: Ideal for applications where visual clarity is essential, ensuring aesthetics and inspection capability.
- Optimal Viscosity: The viscosity range of 2000-3000cps allows smooth application on various substrates, ensuring thorough coverage and penetration.
- Rapid and Flexible Curing: Offers versatile curing options: cure at 70-80°C for 2-4 hours plus 105°C for 4-6 hours, or at 100°C for 6-8 hours, adapting to diverse process requirements.
- Durability & Thermal Resistance: Withstands elevated temperatures up to 120°C, supporting long-term reliability in electronic modules and assemblies.
- Excellent Yellowing Resistance: Proven performance with 26 days of non-yellowing, preserving transparency over time.
- Wide Range of Applications: Designed for potting and bonding in electronics, electrical components, PCBs, and sensors.
- Safe and Consistent Performance: Rigorously tested to industry standards, ensuring consistent quality batch-to-batch.
This advanced epoxy is recommended for users seeking a high-strength, transparent solution for encapsulation and bonding in electronic, automotive, and industrial sectors. Its optimized formula contributes to device protection, insulation, and functional stability.
