Electronics Adhesive
Electronics Adhesives Manufacturer Bonding, Potting & Encapsulation
At ZDS, we produce high‑performance electronics adhesives in our own factory under stringent OEM/ODM and private-label standards. Whether you require epoxy, silicone, UV-cure or thermal‑conductive adhesives, we offer no‑MOQ supply, fast sampling, and rapid prototyping to meet your production deadlines.
Factory Capability Proof
Dedicated Adhesive Production Lines
Separate epoxy, silicone, acrylic and UV‑cure lines to prevent cross‑contamination.
Monthly Capacity up to 120 tons
Enough to support small OEM batches and full-scale production runs alike.
In-House Lab & QC Flow
Raw material testing → batch control → tensile/dielectric strength testing → cure-time verification → final batch release.
Environmental & Safety Compliance
All adhesives formulated in compliance with RoHS and IPC class specifications; VOCs and hazardous content minimized.
ZDS Electronics Adhesives
| Model | Category | Appearance | Viscosity | Curing | More |
|---|---|---|---|---|---|
| ZDS-5013AB | Epoxy | More | |||
| ZDS-2186AB | Acrylic | Amber liquid | 18000-30000 cps | 5-8 min @25°C | More |
| ZDS-PA1600AB | Acrylic | 8 min @25°C | More | ||
| ZDS-703AB | Epoxy | More | |||
| ZDS-5017AB | Acrylic | More | |||
| ZDS-1346AB | Acrylic | 5 min @25°C | More | ||
| ZDS-4018AB | UV | 1200-1800 cps | 10-30 s @365-405nm | More | |
| ZDS-5014AB | Epoxy | 24 h @25°C | More | ||
| ZDS-1101AB | Epoxy | 50000-80000 cps | 30 min @25°C | More | |
| ZDS-2109011 | Acrylic | Colorless to light yellow transparent liquid | 12000-35000 cps | 150-200mj (50W LED light 395nm) | More |
| ZDS-2201061 | UV | Transparent or yellowish liquid | 7 cps | 200 mJ @ 365/395nm LED light | More |
| ZDS-2011031 | UV | Translucent liquid (thixotropic) | 10000-25000 cps | 880mj exposure (2KW medium pressure mercury lamp) | More |
Application Solutions: Where Electronics Adhesives Add Value
| Application | Typical Adhesive Type | Benefits |
| PCB bonding / component attachment | Epoxy adhesive electronics, dielectric adhesive | Strong adhesion, electrical isolation, flux resistant |
| Potting & encapsulation of modules (power supplies, sensors) | Silicone potting compound, epoxy-based encapsulant | Mechanical protection, moisture/ dust sealing, thermal stability |
| Thermal interface / heat dissipation (LED, power electronics) | Thermal conductive adhesive | Efficient heat transfer, improved component lifespan |
| Display or module bonding (smartphones, wearables) | UV cure electronics glue, flexible silicone adhesive | Fast cure, clear bond, minimal stress on components |
| Underfill for BGA / CSP / fine-pitch components | Underfill adhesive for BGA, low-viscosity epoxy adhesives | Enhanced mechanical support, thermal cycling durability |
| EMI shielding & grounding housings | Conductive epoxy adhesive, conductive encapsulant | Electrical continuity, shielding, reliable grounding |
Material Decision Matrix
| Material Type | Typical Use | Pros | Cons / Considerations |
| Epoxy Resin (two part) | PCB bonding, encapsulation, potting | High strength, durable, good dielectric | Longer cure; harder – may stress brittle components |
| Silicone (RTV / potting grade) | Flexible sealing, potting sensors/LEDs | Flexibility, vibration resistance, moisture sealing | Lower structural strength; limited heat transfer |
| Thermal Conductive Epoxy/Silicone | Heat dissipation for power LEDs, modules | Thermal conductivity, adhesion to metal/plastic | Higher cost; may require controlled cure |
| UV Cure Acrylic / Methacrylate | Transparent bonding, display assembly | Extremely fast cure, clean process, low stress | Requires UV-accessible geometry; limited gap fill |
| Conductive Epoxy / Silver filled Adhesive | EMI shielding, grounding, conductive mounting | Electrically conductive, strong adhesion | More expensive; careful handling needed |
| Low Viscosity Epoxy (Underfill) | BGA/CSP underfill, fine-pitch components | Good gap penetration, strong bonding | Requires dispensing control; slow cure |
Performance Parameter Table
| Parameter | Typical Range / Spec | Importance |
| Tensile/Shear Strength (adhesion) | 10–25 MPa | Ensures component stability under mechanical stress |
| Dielectric Strength | ≥ 15–25 kV/mm | Critical for electrical isolation in high voltage circuits |
| Thermal Conductivity (for thermal adhesives) | 1.0–4.0 W/m·K | Helps dissipate heat from power electronics or LEDs |
| Operating Temperature Range | –40 °C to +150 °C (silicone) / –40 °C to +200 °C (epoxy) | Determines suitability for automotive / power applications |
| Cure Time / Pot Life | 5–60 min (UV) / 30 min–24 h (epoxy) | Affects production throughput and assembly scheduling |
| Viscosity / Gap Fill Capability | 50–5000 cPs (depending on type) | Influences ease of dispensing and suitability for tight clearances |
Real Industry Use Cases
Automotive Sensor Encapsulation
An automotive supplier for LIDAR sensors required a silicone potting compound that resists vibration, temperature swings, and moisture ingress. ZDS delivered a custom silicone potting grade adhesive that sealed the sensor electronics while maintaining flexibility and dielectric isolation — preserving long-term reliability on the road.
LED Module Thermal Management
A large LED module manufacturer faced overheating issues on high-power modules. Our thermal conductive epoxy adhesive improved heat dissipation to the heat-sink housing — reducing junction temperature by 20 °C, extending LED lifespan, and avoiding early failure.
Smartphone Display Assembly
In a mobile OEM’s display line, UV cure electronics adhesive from ZDS enabled fast, dust‑free bonding of screens to frames. With consistent cure in under 10 seconds under UV lamps, assembly throughput increased by 30 % while maintaining optical clarity and adhesion strength.
Industrial BGA Board Underfill
An electronics contract manufacturer servicing industrial controllers needed underfill adhesive for BGA/CSP components to avoid solder joint failures under thermal cycling. Our low‑viscosity underfill adhesive flowed deeply into the gaps, cured to a resilient dielectric bond and improved thermal cycling durability.
These real-world examples illustrate how ZDS electronics adhesives solve critical pain‑points — from thermal management and sealing to assembly speed and long-term reliability.
Sampling & Rapid Prototyping
- No MOQ for samples — even 100 g bottles are available for evaluation.
- Rapid prototyping — custom formulations tailored to your substrate (metal, plastic, ceramic, PCB FR-4, etc.) can be delivered within 7–10 working days.
- Private Label / OEM blank‑label option — adhesive supplied under your brand.
FAQs
What kinds of electronics adhesives do you offer?
We supply epoxy-based adhesives, silicone potting compounds, thermal-conductive adhesives, UV-cure glues, conductive epoxies, and low-viscosity underfill adhesives — covering bonding, potting, encapsulation, heat dissipation, EMI shielding, and more.
Can I get small samples before ordering bulk?
Yes. We offer no-MOQ samples — even as little as 100 g — so you can test performance, adhesion, cure time, and compatibility with your substrates.
Do you support custom formulations or private-label production?
Absolutely. Our factory supports OEM/ODM with private-labeling, and we can adjust viscosity, thermal conductivity, cure profiles, or other parameters to meet your process needs.
What performance data do you provide for each adhesive batch?
Each batch comes with full QC documentation, including tensile/shear strength, dielectric strength, viscosity, cure profile, thermal conductivity (if applicable), and operating temperature range.
Are your adhesives compliant with RoHS and other electronics standards?
Yes — all adhesive formulations are compliant with RoHS and relevant electronics industry standards. We minimize or eliminate hazardous content such as high-VOC solvents and restricted heavy metals.
How quickly can you deliver bulk orders after sample approval?
After sample approval, bulk production typically begins within 3–5 weeks depending on volume. Our dedicated adhesive lines ensure fast and consistent delivery.
Can your adhesives handle high-temperature applications, such as power electronics or automotive use?
Yes. Our epoxy adhesives operate reliably up to 200 °C, and silicone potting compounds maintain stability from –40 °C to +150 °C — ideal for automotive, industrial, or high-power applications.