ZDS-168AB-GD High Strength Epoxy Adhesive for Electronics
ZDS-168AB-GD is a top-performance, two-component epoxy adhesive engineered to deliver superior bonding and insulation within electronic, smart, and new energy applications. Its innovative formula is designed to withstand harsh environments, providing outstanding protection against moisture, temperature extremes, and electrical interference. With optimal viscosity ranging from 2000 to 3000 cps, the adhesive ensures smooth and consistent coverage for both manual and automated dispensing applications. Upon curing, it achieves a hardness rating of 85 Shore D, ensuring rugged protection and durability for sensitive electronic components.
- Excellent insulation properties safeguard electronic circuitry from short circuits and external moisture.
- Fast cure time of 30-40 minutes at ambient temperature maximizes productivity without sacrificing quality.
- Adaptable color options (black, white, transparent) suit various device aesthetics and assembly requirements.
- Waterproof design ensures reliable long-term outdoor and indoor use, even in demanding environments.
- Highly resistant to high and low temperature fluctuations, protecting assemblies in automotive, solar, and industrial devices.
- Precise 2:1 mixing ratio guarantees an optimal blend for consistent results and reliable performance every use.
Ideal for potting, sealing, and encapsulating electronic components, this adhesive accommodates a range of substrate materials including plastics, metals, ceramics, glass, and PCB boards. Whether youโre manufacturing smart devices, automotive electronics, batteries, or renewable energy modules, ZDS-168AB-GD delivers peace of mind and proven results for modern industry demands.
