High-Performance Low Viscosity Epoxy Adhesive for Electronics
The ZDS-168AB-1 epoxy adhesive is engineered to meet the most demanding requirements in electronic device manufacturing, specifically catering to PCB encapsulation, LED protection, and intelligent device assembly. With a low viscosity range of 2000-3000 cps, this adhesive enables excellent flow and easy impregnation even in complex assemblies and fine gaps. Its rapid initial curing time, between 10 to 60 minutes at room temperature (25°C), allows for increased throughput without compromising the bond’s strength. Once fully cured, it achieves a robust hardness of Shore D 75, ensuring optimal protection against mechanical stress and environmental hazards.
- Outstanding insulation and waterproof performance ideal for electronics.
- Available in transparent, black, or white options for versatile applications and aesthetic requirements.
- Supports mixing ratios of 2:1, 3:1, and 4:1 for customized pot life and mechanical properties.
- Suitable for potting, bonding, and sealing of components in electronic devices, LED lighting, and smart modules.
- Long working time of up to 1-10 hours enables flexibility for both automated and manual assembly.
- Provides reliable resistance to moisture, chemicals, and temperature fluctuations, safeguarding sensitive circuits and components.
- Designed for use in a variety of industries, including consumer electronics, automotive electronics, industrial controls, and renewable energy systems.
This two-part epoxy solution guarantees operational efficiency and stable protection for advanced electrical designs.
