High-Performance Silicone Adhesive for Mobile Phone Mold Peeling
ZDS-3603 is an advanced silicone adhesive designed specifically for mobile phone mold applications and sealing tasks where efficient demolding and paste-like application are required. Featuring a blue thixotropic paste formulation, ZDS-3603 provides outstanding adhesion and excellent mechanical properties, making it suitable for demanding electronic manufacturing scenarios. Its moderate hardness (65-75 Shore A) ensures a balance between flexibility and durability, which is essential for withstanding mechanical stresses and maintaining a reliable seal over time.
- Effortless application: The thixotropic paste allows for easy dispensing and ensures that it stays in place without sagging, even on vertical surfaces.
- Excellent peelability: Designed to facilitate smooth mold release in mobile device assembly lines, minimizing residue and enhancing productivity.
- Versatile sealing capability: The adhesive is suitable for sealing tasks requiring precision and longevity, maintaining strong bonds with plastic and metal materials typically found in electronics housings.
- UV curable: With a cure energy requirement of 800-1500mj, the product can be efficiently cured using a 50W LED light source, supporting fast and reliable production cycles.
- Wide operating viscosity: The viscosity range (20000-60000 cps) is tailored for both manual and automated dispensing systems, offering consistent results.
This silicone adhesive is ideal for use in the electronics industry, especially for tasks involving mobile phone manufacturing, assembly, and repair where mold peeling and sealing performance are critical.
