ZDS-527 Dealcoholization Adhesive for Circuit Boards
The ZDS-527 is a single-component alkoxy adhesive specially engineered for bonding, sealing, and reinforcing electronic circuit board components. Designed with a dealcoholization curing mechanism, this product boasts excellent adhesion and mechanical strength, making it ideal for high-reliability electronics manufacturing.
- Compliance: UL94V-0 flame retardancy, REACH, and RoHS standards ensure safety and environmental protection for global markets.
- Appearance: Available in black and white paste form, allowing for discrete or color-selective applications on various PCB surfaces.
- Versatile Application: Suitable for bonding circuit board components, sealing, and reinforcement tasks, ensuring structural integrity and enhanced durability of electrical assemblies.
- Rapid Cure: Cures within 5–15 minutes at room temperature, enabling efficient production processes and fast turnaround times.
- Mechanical Performance: After curing, ZDS-527 offers superior hardness (Shore A 55-65), high tensile and shear strength, and excellent elongation for robust vibration resistance.
- Packaging Options: Flexible packaging in 100ml, 300ml, and 2600ml containers to suit different scale applications.
- Storage: Shelf life of 6 months under proper storage conditions.
This adhesive is trusted by electronics manufacturers for its reliable performance in critical bonding and sealing operations, especially for circuit boards in consumer electronics, automotive modules, and industrial control devices. Its flame retardancy and compliance profile make it suitable for international markets and safety-sensitive applications.
