ZDS-626 Electronic Components Waterproof Bonding Adhesive

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BrandZDS
ModelZDS-626
AppearanceBlack/White paste
Viscosity1.35-1.4 cps
Hardness45 Shore D
Curing Timeโ‰ค15 min @25ยฐC
Service Temperature-60~200 ยฐC
Packaging100ml / 300ml / 2600ml
Shelf Life6 months
Waterproof SealingYes

High-Performance ZDS-626 Epoxy Adhesive for Electronics

The ZDS-626 is a superior quality single component epoxy adhesive, meticulously engineered for dealcoholization type bonding applications. Specifically designed for electronic industry needs, this adhesive excels at bonding, positioning, and reinforcing electronic components directly on circuit boards. Its robust versatility ensures secure adhesion on engineering plastics, metals, glass, ceramics, and even optoelectronic guardrail tubes, providing both strong mechanical properties and waterproof sealing essential for durability.

  • Dual-color black or white paste for visual identification and compatibility
  • Optimized for PCB usage, ensuring precise component placement and long-term reliability
  • Excellent adhesion to composite and engineering plastics, metals, ceramics, and glass
  • Fast curing time under room temperature conditions for efficient workflow
  • Wide service temperature range from -60ยฐC up to +200ยฐC for stability in demanding environments
  • Multiple packaging sizes (100ml, 300ml, 2600ml) suitable for small and large-scale operations
  • Shelf life up to 6 months guarantees product reliability

This epoxy adhesive not only excels in bonding tasks but also provides robust waterproof sealing needed in precision optoelectronic assemblies. Its superior temperature tolerance and mechanical strength make it the adhesive of choice across electronics, optoelectronics, and advanced manufacturing. Upgrade your production processes and improve component reliability with ZDS-626.

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